The 8-inch sapphire wafers can enable chip makers to roll out more productivity, which will help them drive down costs dramatically.
CRYSCORE is qualified to supply 8-inch epi-ready sapphire wafers. The common thickness is 1300 μm and 1500 μm.
Generally, this series of polished sapphire wafer has a notch instead of a major flat, but flat with custom length is also available. Our sapphire wafers are cleaned in class 100 cleanroom by ultrapure water with quality above 18MΩ *cm, and then packed in clean cassettes.
Item | 8-inch C-plane(0001) 1300μm Sapphire Wafers | |
Crystal Materials | 99,999%, High Purity, Monocrystalline Al2O3 | |
Grade | Prime, Epi-Ready | |
Surface Orientation | C-plane(0001) | |
C-plane off-angle toward M-axis 0.2 +/- 0.1° | ||
Diameter | 200.0 mm +/- 0.2 mm | |
Thickness | 1300 μm +/- 25 μm | |
Single Side Polished | Front Surface | Epi-polished, Ra < 0.2 nm (by AFM) |
(SSP) | Back Surface | Fine ground, Ra = 0.8 μm to 1.2 μm |
Double Side Polished | Front Surface | Epi-polished, Ra < 0.2 nm (by AFM) |
(DSP) | Back Surface | Epi-polished, Ra < 0.2 nm (by AFM) |
TTV | < 30 μm | |
BOW | < 30 μm | |
WARP | < 30 μm | |
Cleaning / Packaging | Class 100 cleanroom cleaning and vacuum packaging, | |
25 pieces in one cassette packaging or single piece packaging. | ||
Note: Custom sapphire wafers with any orientation and any thickness can be provided.
Introduction to the Manufacturing Process of Sapphire Ingot
Company brochure
The Technical Difference Between the Kyropoulos Method and the Czochralski Method for Growing Sapphire Crystals
